Whether for inspection under Flip Chips or for inspection of hidden solder joints where standard microscopes cannot see,
ERSASCOPE technology offers a significant added value to any Quality Assurance program!
Convince yourself of the significant advantages of the ERSASCOPE Inspection technology!
Take a few minutes to view the ERSASCOPE demo video. (3.5 minutes)
 BGA: Partial reflow |  BGA: Cold solder joint |
 BGA: Micro crack |  PLCC: Micro crack |
 BGA: Partial reflow |  PGA: Partial reflow |
 PQFP: Partial reflow |  PLCC: Interior filoets |
 BGA: Whisker |  BGA: Flux residue |
 CCGA: Mikroriß |  Flip Chip |
 BGA: Disturbed solder joint |  BGA: Micro crack |
 BGA: Micro crack |  BGA: Micro crack |
 CSP: Interior solder balls |  PTH: Micro crack |
 BGA: Flux residue |  Flip Cip |
 CSP: Cold solder joint |  Drücksensor: Micro cracks |
 BGA: Solder Splash |  0201 |
 CCGA:Cold solder joint |  Wire Bond |
 BGA: De-gassing |  BGA "Scaling" |
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