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Whether for inspection under Flip Chips or for inspection of hidden solder joints where standard microscopes cannot see,

  

ERSASCOPE technology offers a significant added value to any Quality Assurance program!

 

Convince yourself of the significant advantages of the ERSASCOPE Inspection technology!

 

Take a few minutes to view the ERSASCOPE demo video. (3.5 minutes)




BGA: Partial reflow


BGA: Cold solder joint


BGA: Micro crack


PLCC: Micro crack


BGA: Partial reflow


PGA: Partial reflow


PQFP: Partial reflow


PLCC: Interior filoets


BGA: Whisker


BGA: Flux residue


CCGA: Mikroriß


Flip Chip


BGA: Disturbed solder joint


BGA: Micro crack


BGA: Micro crack


BGA: Micro crack


CSP: Interior solder balls


PTH: Micro crack


BGA: Flux residue


Flip Cip


CSP: Cold solder joint


Drücksensor: Micro cracks


BGA: Solder Splash


0201


CCGA:Cold solder joint


Wire Bond


BGA: De-gassing


BGA "Scaling"

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