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Dip & Print Station

   

Dip & Print Station with squeegee and a variety of stencils


 

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The ERSA Dip & Print Station enables effective preparation of multiple component body types before rework. Fluxes or solder pastes can be applied to the landing areas precisely, reproducibly and very easy in handling.

Optional dip-in stencils allow for easy flux or solder paste dipping. This process is suitable for many BGA and Fine-Pitch-type SMD components. The component pins are simply dipped into a defined reservoir of flux gel or solder paste. Using a component-specific print stencil the pins of QFNs / MLFs or further SMD components can be printed very easily with a precise solder paste amount.

In the printing process the component is fixed to the stencil and printed with solder paste on

its bottom side. After flipping it back, the component is positioned on the PCB with the placement unit.

Adequate frame fixtures to attach the stencil frame of the Dip & Print Station to the placement unit are available for every ERSA rework system.

Ordering information:

 

Order Number

Name

0PR100-D001

Dipping stencil 40 x 40 / 300 µm

0PR100-D002

Dipping stencil 20 x 20 / 150 µm

0PR100-D003

Dipping stencil 20 x 20 / 100 µm

0PR100-D004

Dipping stencil 40 x 40 / 100 µm

0PR100-PL550

Frame fixation PL 550

0PR100-PL650

Frame fixation PL 650

0PR100-R001

Squeegee 70 x 25 mm, 0.3 mm thick

0PR100-S001

Printing stencil, type 1, BGA 225

0PR100-S002

Printing stencil, type 2, MLF 32

0PR100-S003

Printing stencil, type 2, QFN 20




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