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Dip & Print Station

   

Dip & Print Station with squeegee and a variety of stencils


 

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The ERSA Dip & Print Station enables effective preparation of multiple component body types before rework. Fluxes or solder pastes can be applied to the landing areas precisely, reproducibly and very easy in handling.

 

Optional dip-in stencils allow for easy flux or solder paste dipping. This process is suitable for many BGA and Fine-Pitch-type SMD components. The component pins are simply dipped into a defined reservoir of flux gel or solder paste. Using a component-specific print stencil the pins of QFNs / MLFs or further SMD components can be printed very easily with a precise solder paste amount.

 

In the printing process the component is fixed to the stencil and printed with solder paste on

its bottom side. After flipping it back, the component is positioned on the PCB with the placement unit.

Adequate frame fixtures to attach the stencil frame of the Dip & Print Station to the placement unit are available for every ERSA rework system.

 

Ordering information:

  

0PR100 Dip & Print Station  
0PR100-D001 Dip stencil 40 x 40 mm 
0PR100-D002 Dip stencil 20 x 20 mm
0PR100-PL550 Frame fixation PL 550 
0PR100-PL650 Frame fixation PL 650 
0PR100-S001 Print stencil BGA 225  
0PR100-S002 Print stencil MLF 32  
0PR100-S003 Print stencil QFN 20 
0PR100-R001 

Squeegee 70 x 25 mm,

0.3 mm thick  

 




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